Silicon Photonic Chips
Data Centre 400G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip;
Data Centre 800G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip;
Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip；
etc.
Photonic Interconnection Optical Passive Products
Passive product lines,conventional and specialised,fibre arrays and coupled optical devices are now in mass production.
Customized
Fibre-optic array customisation, integrated photonic commissioning and packaging services, etc.
Agent Products
INNOV has been acting as an agent of Albis since 2018, jointly promoting products and solutions in the Chinese market with Albis. With its professionalism and rich industry resources, Ecomicro has assisted many photovoltaic customers to successfully adopt Albis products to complete their project development.
Data Center
The bridge between data centre servers and switches is an optical module product. Optical modules are one of the indispensable products that make up a data centre, and optical chips are the core products that make up optical modules.
Data Center DCI
Data Centre Interconnection Optical Module is used for the connection between servers and switches, switches and switches, etc. It is used for data transmission and exchange. Optical Module is an indispensable part of Data Centre, and optical chip is the core product that makes up the optical module.
Photoelectric Sealing CPO
Combined Packaging Optical is the co-packaging of chips and modules by assembling the switching chip and the optical engine together in the same . The optical chip is an important part of the optical engine.
4*100G DR4 Silicon Photonic Chip(400G-DR4)
Data Centre 400G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip; Data Centre 800G-DR4/FR4 Silicon Photonics Hybrid Integrated Chip; Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip； etc.
Description：
The 4×100G PAM4 high-integration silicon photonics modulator chip solution integrates four 53Gbaud silicon modulators along with various active and passive silicon photonics components into a single chip. The overall structure is compact and features high density.
Feature：
·4-channel 4×100Gbps high-speed modulator chip.
·Operating wavelength range: 1290~1330nm.
·High phase modulation efficiency.
·Low modulation chirp.·Compact size.
Parameter：
| Input light source | 1-Laser or 2-Laser input |
| On-chip loss | 7.2dB |
| 3dB bandwidth | 35GHz |
| Coupling mode | Edge coupling |
| High phase modulation efficiency | 3mW/Pi |
| MZM Vπ@DC | 7V |
| High ON-OFF ER | ＞20dB |
| Tx optical waveguide damage power | ＞+17dbm |
SUZHOU InnovSemi CO.,LTD