Silicon Photonic Chips
Data Centre 800G-DR4/FR4 Heterogeneous Integration Silicon Photonics,
Data Centre 1.6T-DR8/FR8 Heterogeneous Integration Silicon Photonics,
Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip,
etc.
Photonic Interconnection Optical Passive Products
FA-MT, MT-MT, MPO-FC, FC-FC Optical Connectivity Assemblies, PM-FA, MFD-FA, and Custom Passive Optical Products.
Customized
Fibre-optic array customisation, integrated photonic commissioning and packaging services, etc.
Agent Products
INNOV has been acting as an agent of Albis since 2018, jointly promoting products and solutions in the Chinese market with Albis. With its professionalism and rich industry resources, INNOV has assisted many photovoltaic customers to successfully adopt Albis products to complete their project development.
Data Center
The bridge between data centre servers and switches is an optical module product. Optical modules are one of the indispensable products that make up a data centre, and optical chips are the core products that make up optical modules.
Data Center DCI
Data Centre Interconnection Optical Module is used for the connection between servers and switches, switches and switches, etc. It is used for data transmission and exchange. Optical Module is an indispensable part of Data Centre, and optical chip is the core product that makes up the optical module.
Photoelectric Sealing CPO
Combined Packaging Optical is the co-packaging of chips and modules by assembling the switching chip and the optical engine together in the same . The photonic chip is an important part of the optical engine.
Heterogeneously integrated Photonic Switch Chip
Data Centre 800G-DR4/FR4 Heterogeneous Integration Silicon Photonics, Data Centre 1.6T-DR8/FR8 Heterogeneous Integration Silicon Photonics, Silicon Integrated High Speed Electro-Optical Analogue Modulator Chip, etc.
Description:
The Photonic switch chip utilizes a cascaded MZI (Mach-Zehnder Interferometer) structure with 1×8 switching capabilities.
Features:
·Switching rate: >10MHz.
·Insertion loss per MZI stage: <1dB.
·Channel isolation: >25dB.
Description:
The Photonic switch chip utilizes a cascaded MZI (Mach-Zehnder Interferometer) structure with 1×16 switching capabilities.
Features:
·Switching rate: >10MHz.
·Insertion loss per MZI stage: <1dB.
·Channel isolation: >25dB.
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