The application of silicon photonics is expanding from telecom/datacom transceivers to sensing and computing, driving demand for new building blocks and heterogeneous integration of diverse materials and chips. However, industrial supply chains face challenges, requiring new models with standardized interfaces and test methods.
For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs. That playbook is no longer holding for today’s AI systems. As AI clusters push beyond 100 Tb/s per node, the gap between what silicon can generate and what traditional copper interconnects can deliver is widening fast.
SUZHOU InnovSemi CO.,LTD